Invited Speakers

Considerations of CMP Equipment for Panel-Level Packaging

Dr. Haedo Jeong

G&P Technology, Korea

Abstract Biography
Qnity Cu PCMP Technology Evolution from Mature to Advanced Node

Dr. Ping Hsu

Qnity, Taiwan

Abstract Biography
Advanced Ceria Slurries for SiO2 CMP: Polishing Mechanism of Nanoceria and Emerging Applications

Mr. Minami Hisataka

Resonac Holdings Corp., Japan

TBA

Abstract Biography
Challenges for Pre- and Post-Wafer Bonding CMP Applications

Dr. Wei-Tsu Tseng

IBM, USA

TBA

Abstract Biography
CMP Process Innovations, Growing Needs and Challenges Imposed by New Architectures, New Materials and Dimensional Scaling for Logic and Advanced Interconnects

Dr. Nancy Heylen

imec, Belgium

TBA

Abstract Biography
Research on Atomic-Scale Tribochemistry Underlying Wafer-Scale Global Planarization of Advanced Integrated Circuits

Prof. Lifei Zhang

Tsinghua Univ., China

TBA

Abstract Biography

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