ICPT 2026 offers a premier platform for global academic researchers, industry professionals, and engineers to share the latest advancements in Chemical Mechanical Polishing (CMP) and other planarization technologies.
Advanced Interconnect CMP (Metal)
Dielectric & Hard materials CMP
Advanced Packaging / 3D Integration CMP (Hybrid Cu Bonding, BSPDN, Wafer Thinning)
Post-CMP Cleaning / Defect Engineering
AI & ML for CMP / Process Control
Metrology & Inspection / Equipment / Process Diagnostics
CMP Consumables (Slurry, Abrasive, Pad, Conditioner, Filter etc.,)
CMP Fundamentals (Tribology, Multiphysics Modeling etc.,)
Nanomaterials & Surface Engineering for CMP
Sustainable CMP / Manufacturing Readiness
Organized by
Sponsored by
