Tutorial Program

08:30 – 09:15 Registration
09:15 – 09:20 Opening Remarks (Tutorial Chair: Kangchun Lee)
Session 1: The "M" in CMP: Mechanical Aspects of Planarization
(Session Chair: Kangchun Lee)
09:20 – 10:20 Fundamentals of CMP Mechanics Prof. Hyunseop Lee
(Dong-A Univ.)
10:20 – 11:20 Introduction to CMP Equipment Dr. Sukbae Joo
(Applied Materials)
11:20 – 12:20 Fundamentals of Pads Prof. Sanha Kim
(KAIST)
12:20 – 13:30 Lunch
Session 2: The "C" in CMP: Chemical Aspects of Planarization
(Session Chair: Sanha Kim)
13:30 – 14:30 Fundamentals of CMP Abrasives Prof. Kangchun Lee
(Kwangwoon Univ.)
14:30 – 15:30 Fundamentals of CMP Chemistry Prof. Jihoon Seo
(Hanyang Univ.)
15:30 – 15:50 Coffee Break
Session 3: Beyond the "C" & "M": Cleaning and Process Control
(Session Chair: Jihoon Seo)
15:50 – 16:50 Fundamentals of Post-CMP Cleaning Prof. Taegon Kim
(Hanyang Univ.)
16:50 – 17:50 AI-assisted CMP: A Case-based Introduction Dr. Hanchul Cho
(KITECH)
17:50 – 17:55 Closing Remarks (Tutorial Chair: Kangchun Lee)

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