| Conference Chair | Sangwoo Lim (Yonsei Univ., Korea) | ||
|---|---|---|---|
| Conference Secretary | Tae-Gon Kim (Hanyang Univ., Korea) | ||
| Organizing Committee Chairs | Jin-Goo Park (Hanyang Univ., Korea) | ||
| Taesung Kim (Sungkyunkwan Univ., Korea) | |||
| Program Committee Chairs | Program Chair | Sanha Kim (KAIST, Korea) | |
| Publication | Jihoon Seo (Hanyang Univ., Korea) | ||
| Co-Publication | Hyunseop Lee (Dong-A Univ., Korea) | ||
| Tutorial Program | Kangchun Lee (Kwangwoon Univ., Korea) | ||
| Industry Cooperation Committee | Industry Committee Chair | Haedo Jeong (Pusan Nat’l Univ., Korea) | |
| Industry Committee Members | Ki-Ho Bae (Samsung Electronics Co., Ltd., Korea) | ||
| Mincheol Kang (SK hynix, Korea) | |||
| Jae-Dong Lee (KC Tech, Korea) | |||
| Jaebum Jeon (EBARA, Korea) | |||
| Sukbae Joo (Applied Materials, Korea) | |||
| Andy Kim (Qnity, Korea) | |||
| Yongsik Moon (Ehwa Diamond, Korea) | |||
| Youngsam Lim (YCCHEM Co., Ltd., Korea) | |||
| Don Kim (3M, Korea) | |||
| Hyung-il Lee (Synopex, Korea) | |||
Jingoo Park (Hanyang Univ.)
Taesung Kim (Sungkyunkwan Univ.)
Xinchun Lu (Tsinghua Univ.)
Xinping Qu (Fudan Univ.)
Patrick Ong (imec)
Knut Gottfried (Fraunhofer ENAS)
Syuhei Kurokawa (Kyushu Univ.)
Takashi Watanabe (KIOXIA Corp.)
Eddy Peng (Hermes-Epitek Corp.)
Willie Pai (KINIK)
Jeff McKinnis (Fujimi Corp.)
Rob Rhoades (Kothar Technologies)
Sanha Kim (KAIST)
Hyunseop Lee (Dong-A Univ.)
Kangchun Lee (Kwangwoon Univ.)
Sangwoo Lim (Yonsei Univ.)
Renhe Jia (Anstinc Technology)
Yuchun Wang (Anji Microelectronics)
Baoguo Zhang (Hebei Univ. of Technology)
Lifei Zhang (Tsinghua Univ.)
Cathérine Euvrard (CEA-Leti)
Eric Jacquinot (Merck KGaA)
Cedric Perrot (CEA-Leti)
Catharina Rudolph Fraunhofer (IZM-ASSID)
Yasuhisa Sano (The Univ. of Osaka)
Kazumi Sugai (Fujimi Inc)
Norikazu Suzuki (Kobe Univ.)
Michio Uneda (Gifu Univ.)
Chih Chen (Yang Ming Chao Tung Univ.)
Chao-Cheng Arthur Chen (NTUST)
Ming-shih Tsai (BASF)
Andy Tuan (Linx Consulting Inc.)
Mark Buehler (Intel)
Don Frye (Entegris)
Bradley Wood (SPS International)
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