※ Click the session title to see detailed schedules.
※ “★” Mark: Student Presentation
as of September 3, 2026
| October 19 (Mon.) |
Time | Session Room | Exhibition Hall | |
|---|---|---|---|---|
| Main Auditorium 1 | Main Auditorium 2 | Lobby, B1F | ||
| 09:15 - 09:20 | Opening Remarks | Registration (08:30-17:00) |
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| 09:20 - 12:20 | [Tutorial Session 1] The "M" in CMP: Mechanical Aspects of Planarization | |||
| 12:20 - 13:30 | Lunch | |||
| 13:30 - 15:30 | [Tutorial Session 2] The "C" in CMP: Chemical Aspects of Planarization | |||
| 15:30 - 15:50 | Coffee Break | |||
| 15:50 - 17:50 | [Tutorial Session 3] Beyond the "C" & "M": Cleaning and Process Control | |||
| 17:50 - 17:55 | Closing Remarks | |||
| 17:55 - 18:00 | Break | |||
| 18:00 - 20:00 | [Member Only] Executive Committee Meeting (Iris Hall, 12F) | |||
| October 20 (Tue.) |
Time | Session Room | Exhibition Hall | |
|---|---|---|---|---|
| International Conference Hall | Main Auditorium 2 | Lobby, B1F | ||
| 09:15 - 09:25 | Opening Ceremony | Exhibition |
Registration (08:30-18:00) & Exhibition |
|
| 09:25 - 09:55 |
[Keynote Speech 1] "HBM-HBF Memory Architecture and Interconnection Innovations for Next Generation Agentic AI with Token Economics" Prof. Joungho Kim (KAIST, Korea) |
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| 09:55 - 11:20 | [Oral Session 1] CMP for Advanced Interconnects (I) | |||
| 11:20 - 11:35 | Coffee Break | |||
| 11:35 - 12:55 | [Oral Session 2] CMP for Advanced Interconnects (II) | |||
| 12:55 - 14:20 |
Diamond Sponsors' Exclusive Luncheon Keynote Speeches (Levitronix / Qnity Electronics, Inc. / Hubei Dinglong Co., Ltd.) |
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| 14:20 - 15:20 | [Oral Session 3] CMP for Advanced Packaging/3D Integration (I) | |||
| 15:20 - 15:35 | Coffee Break | |||
| 15:35 - 16:35 | [Oral Session 4] Metrology & Inspection / Equipment / Process Diagnostics | |||
| 16:35 - 16:55 | Coffee Break | |||
| 16:55 - 17:55 | [Oral Session 5] AI & ML for CMP / Process Control | |||
| 17:55 - 18:00 | Break | |||
| 18:00 - 20:00 | Welcome Reception (Anais Hall, 12F) / [Member Only] Program Committee Meeting (Iris Hall, 12F) | |||
| October 21 (Wed.) |
Time | Session Room | Exhibition Hall | |
|---|---|---|---|---|
| International Conference Hall | Main Auditorium 2 | Lobby, B1F | ||
| 09:15 - 09:45 |
[Keynote Speech 2] "Memory Subsystems for AI: Bridging Performance and Energy from Cloud to Edge" Prof. Dongkyun Kim (SK hynix, Korea) |
Exhibition |
Registration (08:30-18:00) & Exhibition |
|
| 09:45 - 11:10 | [Oral Session 6] CMP for Advanced Packaging / 3D Integration (II) | |||
| 11:10 - 11:25 | Coffee Break | |||
| 11:25 - 12:50 | [Oral Session 7] Post-CMP Cleaning / Defect Engineering | |||
| 12:50 - 13:00 | Award Ceremony | |||
| 13:00 - 13:10 | Group Photo | |||
| 13:10 - 15:10 | Poster Session (Gallery, 1F) with Lunch | |||
| 15:10 - 16:35 | [Oral Session 8] CMP Consumables (I) | |||
| 16:35 - 16:50 | Coffee Break | |||
| 16:50 - 17:55 | [Oral Session 9] Sustainable CMP / Manufacturing Readiness | |||
| 17:55 - 18:30 | Break | |||
| 18:30 - 20:30 | Banquet (AMORIS, 1F, GS Tower) | |||
| October 22 (Thu.) |
Time | Session Room | Exhibition Hall | |
|---|---|---|---|---|
| International Conference Hall | Main Auditorium 2 | Lobby, B1F | ||
| 09:15 - 09:45 |
[Keynote Speech 3] "CMP at the Inflection Point: Enabling Sub-2nm and Beyond" Mr. Hoyoung Kim (Samsung Electronics Co., Ltd., Korea) |
Exhibition |
Registration (08:30-13:00) & Exhibition |
|
| 09:45 - 11:10 | [Oral Session 10] CMP Fundamentals | |||
| 11:10 - 11:25 | Coffee Break | |||
| 11:25 - 12:45 | [Oral Session 11] CMP Consumables (II) | |||
| 12:45 - 12:55 | Student Paper Award Ceremony | |||
| 12:55 - 13:05 | Closing Ceremony | |||
| 13:05 - 18:00 | Optional Tour | |||
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