Program at a Glance

Detailed Program

※ Click the session title to see detailed schedules.

※ “★” Mark: Student Presentation

as of October 12, 2026

	Time	International Conference Hall	Exhibition	Registration
October 19 (Mon.)	Time	Session Room	Exhibition	Registration
	09:15 - 09:20	Opening Remarks		Lobby, 1F (08:30–18:00)
	09:20 - 12:20	[Tutorial Session 1] The "M" in CMP: Mechanical Aspects of Planarization
	12:20 - 13:30	Lunch
	13:30 - 15:30	[Tutorial Session 2] The "C" in CMP: Chemical Aspects of Planarization
	15:30 - 15:50	Coffee Break
	15:50 - 17:50	[Tutorial Session 3] Beyond the "C" & "M": Cleaning and Process Control
	17:50 - 17:55	Closing Remarks
	17:55 - 18:30	Break
	18:30 - 20:30	[Member Only] Executive Committee Meeting

Session room presentations will be live-streamed to Auditoriums 6 and 7.
October 20 (Tue.)	Time	Session Room	Exhibition	Registration
	Time	International Conference Hall	Exhibition	Registration
	09:15 - 09:25	Opening Ceremony	Main Auditorium 2 Small Conference Room 1 Lobby, B1F (09:00–18:00)	Lobby, 1F (08:30–18:00)
	09:25 - 09:55	[Keynote Speech 1] "HBM-HBF Memory Architecture and Interconnection Innovations for Next Generation Agentic AI with Token Economics" Prof. Joungho Kim (KAIST, Korea)
	09:55 - 11:20	[Oral Session 1] CMP for Advanced Interconnects (I)
	11:20 - 11:35	Coffee Break
	11:35 - 12:55	[Oral Session 2] CMP for Advanced Interconnects (II)
	12:55 - 14:20	Diamond Sponsors' Exclusive Luncheon Keynote Speeches (Levitronix / Qnity Electronics, Inc. / Hubei Dinglong Co., Ltd.)
	14:20 - 15:20	[Oral Session 3] CMP for Advanced Packaging/3D Integration (I)
	15:20 - 15:35	Coffee Break
	15:35 - 16:35	[Oral Session 4] Metrology & Inspection / Equipment / Process Diagnostics
	16:35 - 16:55	Coffee Break
	16:55 - 17:55	[Oral Session 5] AI & ML for CMP / Process Control
	17:55 - 18:00	Break
	18:00 - 20:00	Welcome Reception (Anais Hall + Iris Hall, 12F)
	18:30 - 20:30	[Member Only] Program Committee Meeting

	Time	International Conference Hall	Exhibition	Registration
October 21 (Wed.)	Time	Session Room	Exhibition	Registration
	09:15 - 09:45	[Keynote Speech 2] "Memory Subsystems for AI: Bridging Performance and Energy from Cloud to Edge" Prof. Dongkyun Kim (SK hynix, Korea)	Main Auditorium 2 Small Conference Room 1 Lobby, B1F (09:00–18:00)	Lobby, 1F (08:30–18:00)
	09:45 - 11:10	[Oral Session 6] CMP for Advanced Packaging / 3D Integration (II)
	11:10 - 11:25	Coffee Break
	11:25 - 12:50	[Oral Session 7] Post-CMP Cleaning / Defect Engineering
	12:50 - 13:00	Award Ceremony
	13:00 - 13:10	Group Photo
	13:10 - 15:10	Poster Session (Gallery, 1F) with Lunch
	15:10 - 16:35	[Oral Session 8] CMP Consumables (I)
	16:35 - 16:50	Coffee Break
	16:50 - 17:55	[Oral Session 9] Sustainable CMP / Manufacturing Readiness
	17:55 - 18:30	Break
	18:30 - 20:30	Banquet (AMORIS, 1F, GS Tower)

	Time	International Conference Hall	Exhibition	Registration
October 22 (Thu.)	Time	Session Room	Exhibition	Registration
	09:15 - 09:45	[Keynote Speech 3] "CMP at the Inflection Point: Enabling Sub-2nm and Beyond" Mr. Hoyoung Kim (Samsung Electronics Co., Ltd., Korea)	Main Auditorium 2 Small Conference Room 1 Lobby, B1F (09:00–13:00)	Lobby, 1F (08:30–13:00)
	09:45 - 11:10	[Oral Session 10] CMP Fundamentals
	11:10 - 11:25	Coffee Break
	11:25 - 12:45	[Oral Session 11] CMP Consumables (II)
	12:45 - 12:55	Student Paper Award Ceremony
	12:55 - 13:05	Closing Ceremony
	13:05 - 18:30	Optional Tour

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