Elevate your networking and technical expertise to the next level
at ICPT! With premier technical sessions, interactive poster
presentations, and a high-energy exhibition floor, you will
connect directly with peers and leaders from global IDMs,
foundries, equipment and consumable suppliers, and top-tier
research institutions.
This is your opportunity to build lasting relationships, meet new
collaborators, and discover groundbreaking innovations in
FEOL/BEOL CMP, advanced packaging for HBM, and hybrid bonding—all
within four days that bring together the entire international
planarization community.
We look forward to seeing you at the International Conference on
Planarization/CMP Technology (ICPT 2026) in Seoul, South Korea,
Oct 19-22, 2026!
Sangwoo Lim
ICPT
2026 Conference Chair
